Detector Arrays Directly Contacting the Read-Out Chip

Detector Arrays Directly Contacting the Read-Out Chip 

Imagers having detector arrays directly contacting the read-out chip are presented in this chapter. The imagers having electrical connections made by through hole technologies are presented in a separate section. 

A problem which arises when a read-out chip of for example silicon is attached to a detector 

An imager comprising detectors formed in an HgCdTe layer which has been epitaxially grown on a semiconductor layer of a different material, the semiconductor layer comprising a charge transfer element, is disclosed in US-A-4553152. 

An imager which has a detector substrate and a silicon read-out substrate attached on different sides of a sapphire substrate is presented in JP-A-61128S64. 

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