Design considerations joint geometry

This chapter will discuss the testing, analysis, and design of structural adhesive joints. Adhesive bond test techniques to be considered include tensile, shear, peel, impact, creep, and fatigue. Some considerations will also be given to the effect of environment and test rate. A continuum approach to the analysis of adhesive joints will discuss tensile, shear, and peel stresses which arise in various joint geometries. Classical theories by Volkersen, Goland and Reissner, and others will be included. References to finite element analysis will be made where appropriate throughout the chapter. 

The geometry of a single ACA joint is shown as Fig. 22, and parameters of the chip. Teflon board, and ACA joint are listed in Table 3. To avoid extremely small cells in the FDTD domain, the conductive particles are assumed to have a column shape with a height of 10 pm. A previous study (Ref 43) has shown that there is no significant difference in transmission behavior when 3 or 10 pm particles are used. In the FDTD simulation, the media under consideration were assumed to be uniform, isotropic, and homogeneous. Both the microstrip lines on the chip and on the substrate were designed as 50 Q transmission fines. A pulse with a spectrum of 1 to 30 GHz was used as the excited source. It was applied at the feed-in microstrip that was connected with the microstrip on the chip by flip-chip transition. To avoid electromagnetic reflec-... 

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