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Deposition principle

Smith D L 1997 Thin-Film Deposition Principles and Practice (New York McGraw-Hill)... [Pg.2940]

The deposition principle is relatively simple and a schematic diagram of the equipment is shown in Fig. A high-frequency... [Pg.209]

Hitchman, M. L. and Jensen, K. F., Chemical Vapor Deposition Principles and Applications, Academic Press, New York, 1997. [Pg.432]

In the following, selected results will be presented on the conventional electrochemical synthesis of metal chalcogenide binary and ternary systems, conducted by employing variants of the methods outlined in the previous sections. A brief account of chemical bath deposition principles exemplified will be addressed at the end of this chapter, as being closely related to electrochemical deposition of thin films. [Pg.88]

Pierson, H. O. In Handbook of Chemical Vapor Deposition Principles, Technology, and Applications, 2nd ed. Noyes Norwich, 1999. [Pg.149]

K.F. Jensen. Fundamentals of Chemical Vapor Deposition. In M.L. Hitchman and K.F. Jensen, editors, Chemical Vapor Deposition—Principles and Applications, pages 31-90. Academic Press, London, 1993. [Pg.825]

H.O. Pierson, Handbook of Chemical Vapor Deposition—Principles, Technology and Applications, Noyes Publications, New Jersey, 1992. [Pg.131]

Figure 3. Interface with pulsed field droplet deposition. Principle of the electrically mediated liquid deposition (lower panel). Deposition of the eluents from 4 parallel LC separations (upper panel. A). Samples cociystallized with matrix on hydrophilic islands with 400 pm diameter (upper panel, B) and droplets just before application of electrical field (upper panel, C). Reprinted with permission from Ericson et al. 2003. Copyright 2003 American Chemical Society. Figure 3. Interface with pulsed field droplet deposition. Principle of the electrically mediated liquid deposition (lower panel). Deposition of the eluents from 4 parallel LC separations (upper panel. A). Samples cociystallized with matrix on hydrophilic islands with 400 pm diameter (upper panel, B) and droplets just before application of electrical field (upper panel, C). Reprinted with permission from Ericson et al. 2003. Copyright 2003 American Chemical Society.
M. L. Hitchman and K. F. Jensen, Chemical Vapour Deposition, Principles and Applications, Academic, San Diego, CA, 1993. [Pg.454]

Chemical Vapour Deposition Principles and Applications, Hitchman and Jensenin, 1993 [1]... [Pg.16]

Hitchman ML, Jensen KF (1993) Chemical vapour deposition principles and applications. Academic, New York... [Pg.21]

Smith, D.L., Thin-film deposition Principles and practice, McGraw-Hill, Inc., New York, 1995. [Pg.367]

In this section, the main models for membrane processes are summarised. This allows a basic understanding of rejection and deposition principles and underlines the importance of certain parameters in the different processes. The four membrane types, MF, UF, NF, and RO, are considered in separate sections. [Pg.42]

Veith, M Huch, V. Lisowsky, R. Hobein, P. Z. Anorg. Allg. Chem. 1989, 569, 43. Hitchman, M. L. Jensen, K. F. Chemical vapor deposition—An overview. In Chemical Vapor Deposition Principles and Apphcations, Hitchman, M. L. Jensen, K. F., Eds. Academic Press San Diego, 1993. [Pg.283]

Pierson HO (1992) Handbook of chemical vapor deposition principles, technology and applications. Noyes, Park Ridge... [Pg.428]


See other pages where Deposition principle is mentioned: [Pg.225]    [Pg.269]    [Pg.354]    [Pg.155]    [Pg.156]   
See also in sourсe #XX -- [ Pg.209 ]




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