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Creep grain size

Ceramics, on the other hand, often deform predominantly by diffusional flow (because their grains are small, and the high lattice resistance already suppresses power-law creep). Special heat treatments to increase the grain size can make them more creep-resistant. [Pg.193]

For any given alloy, a coarse grain size possesses the greatest creep strength at the more elevated temperatures, while at the lower temperatures a fine grain size is superior. [Pg.260]

Let us finally mention that in polycrystalline samples, Nabarro-Herring(-Coble) creep occurs as already introduced in Section 14.3.2. The Nabarro-Herring creep rate is inversely proportional to the square of the average grain size, l2, if volume diffusion of point defects prevails. It is inversely proportional to /3 if grain boundary diffusion determines the transport. [Pg.346]

Figure 16.5 Deformation mechanism map for Ag polycrystal a = applied stress, p = shear modulus, grain size = 32 pm, and strain rate = IGF8 s 1. The diffusional creep field is divided into two subfields the Coble creep field and the Nabarro-Herring creep field. From Ashby [20]. Figure 16.5 Deformation mechanism map for Ag polycrystal a = applied stress, p = shear modulus, grain size = 32 pm, and strain rate = IGF8 s 1. The diffusional creep field is divided into two subfields the Coble creep field and the Nabarro-Herring creep field. From Ashby [20].
Hardness and a ductile-to-brittle transition temperature (DBTT) have also been noted to follow a Hall-Petch relationship (Meyers, and Chalwa, 1984). Ductility increases as the grain size decreases. Decreasing grain size tends to improve fatigue resistance but increases creep rate. Electrical resistivity increases as grain size decreases, as the mean free path for electron motion decreases. [Pg.243]

Creep Mild overheating and or mild overstressing at elevated temperatures unstable microstructures and small grain size tend to increase creep rates ruptures occur after long exposure periods verify proper alloy... [Pg.154]

POSTER TITLE Improving the hardness, toughness, wear and creep resistance of NiTiW shape memory thin films by grain size refinement... [Pg.6]

From Eqn. (5) we see that the important intrinsic variables controlling creep are the boundary thickness, w, the grain size, d, and the viscosity of the boundary fluid, tj. If these parameters change in the course of the deformation process, a corresponding change in the creep rate will occur, leading to transient creep behavior. [Pg.135]

Above the threshold, deformation occurs as a consequence of direct particle interaction. Several mechanisms of interaction have been suggested solution-precipitation flow of fluid between particles and cavity formation at the particle matrix interface. These theories of creep suggest several rules to improve creep behavior (1) increase the viscosity of the matrix phase in multiphase materials (2) decrease the volume fraction of the intergranular phase (3) increase the grain size (4) use fiber or whisker reinforcement when possible. As the creep rupture life is inversely proportional to creep rate, lifetime can be improved by improving creep resistance. [Pg.153]

In all expressions the Einstein repeated index summation convention is used. Xi, x2 and x3 will be taken to be synonymous with x, y and z so that o-n = axx etc. The parameter B will be temperature-dependent through an activation energy expression and can be related to microstructural parameters such as grain size, diffusion coefficients, etc., on a case-by-case basis depending on the mechanism of creep involved.1 In addition, the index will depend on the mechanism which is active. In the linear case, n = 1 and B is equal to 1/3t/ where 17 is the linear shear viscosity of the material. Stresses, strains, and material parameters for the fibers will be denoted with a subscript or superscript/, and those for the matrix with a subscript or superscript m. [Pg.307]


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See also in sourсe #XX -- [ Pg.394 , Pg.395 , Pg.400 , Pg.402 ]




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