Copper surface textures

When nucleate boiling takes place on a hot solid, the surface texture of that solid becomes an important variable. A thorough study was made by Corty and Foust (C4), who boiled ether, pentane, and Freon-113 from horizontal, electrically heated copper and nickel surfaces. The surface texture was altered at will by use of different grades of emery polishing paper. 

There has been increasing interest in the process of electro-plating plastics. Plating can produce chromelike, brass, silver, gold, or copper surfaces in both smooth and textured forms. There are several systems available commercially for plating plastic materials. In the case of certain plastics such as electroplated ABS, it can be surface-treated chemically to promote bonding of the metals in subsequent steps. 

During the heterogeneous decomposition of formic acid on copper, the active metaUic phase undergoes sintering, sublimation and modifications of surface texture [25], By comparison with the behaviour of copper(II) formate [13], it is concluded that copper(l) formate is formed. Thus variations in the values of A and E, reported for the catalytic process may be attributed to a dependence of kinetic behaviour on the lifetime of the volatile participant, and thus upon metal mobility and reaction conditions [5], The decompositions of the copper formates and the catalytic decomposition of formic acid on copper metal thus include the participation of common intermediates, but these different reactions each consist of a sequence of several interdependent processes. 

Fio. 7. Effect of surface texture on transition boiling. Methanol was boiled at one atmosphere on a %-inch, horizontal, steam-heated, copper tube (D2). 

Electrolytic Cleaning. A unique inline conveyorized tool built by Atotech uses electrolytic cleaning. - The antitamish is removed electrolytically along with oils and fingerprints in a uniform process with very httle copper removal. The surface texture is then altered by microetching and passivated prior to dry-film photoresist lamination or other coatings. 

Sulfuric-peroxide systems are used extensively for copper surface preparation by microetch-ing the surface to provide texture and active surfaces. These formulations have been used in... 

The aim of these studies was to examine the effect of the heteroatoms on the surface texture and the porosity of ceria, as well as the chemistry of the surface in terms of surface groups present and surface acidity (or basicity), as well as on bulk properties such as crystcd structure and oxygen storage capacity. Vanadium was chosen because of the multiplicity of oxidation states in which it can be present. In previous studies, copper as a guest ion was shown to increase the BET surface area of ceria in certain concentrations. Iron was chosen because of... 

Table 1 contains the pertinent surface texture results for the samples discussed in this presentation. Figure 1 contains the DFT plots for V0.05Cu0.05Ce0.9O2, V0.05Fe0.05Ce0.9O2. The latter was chosen because as it can be seen from Table 1 it exhibits the highest BET sur ce area of all samples in the relevant series, while the former sample is the equivalent where iron has replaced copper. 

The dependence of adsorption properties and texture on electrolytic palladium deposits on the deposition potential was investigated by Tsirlina et al. [116]. It was found that, in sulfuric acid solutions, the palladium dissolution, which accompanies the oxygen adsorption, obscures the adsorption behavior of the deposits with respect to oxygen. Assumptions were made about the predominant crystallographic orientation (100) of the surface of some palladium deposits being dependent on the deposition potential and about the presence of regions whose adsorption properties are anomalous with respect to copper. The assumptions are based on a comparative analysis of the copper adsorption data and x-ray diffraction patterns. In addition to sites of crystalline palladium, the deposits were found to have disordered areas as well. 

Wait several minutes, disconnect a wire, and remove the copper and zinc electrodes. Carefully observe the electrode surfaces and record any changes in color and texture. Look for changes in electrode size. Record all observations. 

Surface modification (texturing) of polyimide through a metal clustering and migration process is reported. This process involves heat treatment of polyimide coated with a thin copper layer. Subsequent metallization of the textured surface leads to improved adhesion due to mechanical anchoring. Adhesion values of 7-10 lbs/in (ambient) and 4-6 lbs/in (after solder float) have been obtained. 

It is obvious from simple geometrical considerations that in any process for applying molybdenum disulphide to a solid substrate, the first contact is likely to be at the peaks of the asperities on the substrate. However, Johnston and Moore were the first to study the burnishing process in detail, using a cylinder covered with fabric to apply molybdenum disulphide powder to a flat copper substrate. They found that in their tests the first hundred traverses of the burnishing device filled the low spots on the substrate so as to produce a smooth surface. Subsequent traverses built up further layers of molybdenum disulphide onto the film, and the film thickness appeared to increase indefinitely without any significant subsequent change in the texture of the surface. 

The t-test analysis (Fig. 2) excludes the presence of micropores and completes the determination of textural data reported in Table 1. By comparing the samples with or without copper, it appears that Cu ion exchange decreases the total surface area and the primary mesopore volume, but without a dramatic reduction of internal accessibility. 

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