Copper-ramified structures

Figure 5.18 In-situ STM images recorded in CUSO4/H2SO4 electrolyte of Cu UPD growth on Au(l 1 1) modified by two different types of thiols, (a) SAM of ethane thiol (250x250nm ) with a ramified structure and (b) SAM of MBP2 (600 x 600 nm ) with circular copper patches [43], Enlarged area reveals nanometer-sized islands protruding on patches, (a) Reproduced with permission from Ref [210].

Copper electrodeposition is an important process in microelectronics technology. An unusual deposit is often formed at the edge of the micropattems, typically a ramified structure [74]. This is an unwanted feature whose creation merits a careful study. 

---