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Copper major crystal faces

Characteristic Data for the Three Major Crystal Faces of Copper... [Pg.102]

Variation of heats of adsor-ption on different major crystal faces of copper. The effect of the crystal face of the adsorbent on physical adsorption has been treated theoretically by Barrer (153) for covalent surfaces and by Orr (151) and by Lenel (154) for dielectric surfaces. The vertical interactions between a nonpolar molecule and a polycrystalline metal surface have been independently treated by Lennard-Jones (155), by Bardeen (156), and by Margenau and Pollard (157). Considering the theoretical limitations involved in the last treatment, the observed agreement between the values calculated theoretically and the experimental values is acceptable. At present no explicit theoretical treatment of the physical adsorption of a nonpolar gas molecule on a single crystal metal surface in terms of the crystal parameter and geometry of the latter is available. [Pg.107]

The first single crystal results were therefore surprising (9,10), a band at 2085 cm-1 being reported for Cu(100) and a band at 2076 cm-1 for Cu(lll). The absence of appreciable absorption at these positions in the spectra of CO on silica- or alumina-supported copper, or in the RAIR spectra of CO on copper films deposited on glass (11,12) and on tantalum ribbons (13), led to the unexpected conclusion (4) that the major low index faces were conspicuous by their scarcity in polycrystalline copper surfaces. [Pg.52]

The wet disks are immediately immersed into the vapor of refluxing isopropanol. Once they reach the reflux temperature, as noted by a reduction in the rate of alcohol condensation on the disks, they are removed into the room air where they rapidly become dry and slowly cool to room temperature. At this point, the disks are individually weighed to the nearest 0.1 mg. The disks are then loaded into a metal tray with large circular regions on their bottom faces exposed and the tray placed in the load lock of a vacuum chamber. The load lock is pumped to about 10 torr and then the tray is translated into the chamber and the load lock sealed off from the chamber. The chamber is pumped to about 10 torr with a cryopump. The major residual gas is water from the rotatable rubber seal used between the evacuated space in the chamber and the water flow path into and out of the rotatable copper crucible mentioned below. Titanium vapor is sublimed from a Ti ingot by bombardment with about 8 keV electrons while the periphery of the ingot is cooled by sparse physical contacts with the water-cooled copper crucible in which it rests. The Ti vapor condenses in the line of sight from the source onto the exposed bottoms of the disks. The thickness of the deposited titanium, is monitored by a calibrated quartz crystal balance close to the quartz disks. Typically (iji 5 x 10 cm. [Pg.149]


See other pages where Copper major crystal faces is mentioned: [Pg.51]    [Pg.52]    [Pg.107]    [Pg.106]    [Pg.111]    [Pg.266]    [Pg.494]    [Pg.8]   
See also in sourсe #XX -- [ Pg.102 , Pg.109 ]




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