Copper foil Roughness

Brist, Gary, Hall, Stephen, Clauser, Sidney, and Liang, Tao, Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment, ECWC10/IPC/APEX Conference, February 2005. 

Figure 6 In-situ valance band data of a copper foil under methanol oxidation conditions (mixture B in Figure 5) during a temperature scan. The temperature was increased linearly with 5 K min, the acquisition of each spectrum took less than 2 min. The line indicates the occurrence of the Fermi edge. The SEM image stems from a 100 pm Cu sphere held for 24 h under methanol oxidation conditions of stoichiometric feed and 572 K reaction temperature. The flat terraces are of [111] orientation, the rough parts expose facets of [112] orientation. An oxide scale from isolation out of the reactor covers the sample...

Copper Foil Thermal and mechanical Copper nodularization and Roughness impacts signal... 

Epoxy does not adhere well to untreated copper surfaces.This means that some type of treatment must be applied to the innerlayer before lamination. One option is to use double-treated copper, discussed earlier. Double-treated copper has a rough surface with a treatment supplied by the material vendor. Many ML-PWB fabricators report excellent results with double-treated copper. Others report problems with contamination and difficulty with rework. The alternative to using pretreated copper foil is to use a chemical treatment after etching. 

Drum side treated (DSTFoil ) or reverse treated foil (RTF) is also an electrodeposited copper foU,bnt the treatments are coated onto the smooth drum side of the foil rather than the matte side, as with conventional electrodeposited foil (see Figs. 7.25 and 7.26).This results in a very-low-profUe surface bonded to the laminate, with the rough matte side facing out. The low... 

Nickel was electrodeposited on polished brass foil at different temperatures (Ni deposit roughness with temperature). Also, Martis et a/. reported that compact nickel multiwalled carbon nanotube composites eould be electrodeposited on a copper substrate using the eutectic mixture ChCl/EG as solvent. Later, electrodeposition of Ni-P alloys (with tunable phosphorous eontent) at room temperature was reported by You and co-workers. ... 

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