Copper depth profile

As in the presence of Ge in Ge ,SWSi-layered alloys [338] and impurity copper depth profiles in As-implanted Si [339]. 

Fig. 42. AES depth profiles of copper and sulfur (top) and zinc and oxygen (bottom) for the brass-on-glass adhesion specimens as a function of curing temperature. Reproduced by permission of Gordon and Breach Science Publishers from Ref. [46].

With LA-ICP-ToF-MS, using the 193 nm ArF laser (laser energy lOOmJ at 120(xm laser beam diameter), a depth resolution of 200 nm per laser shot was measured.121 LA-ICP-MS was utilized for depth profiling of copper coatings on steel with certified copper coating thicknesses from about... 

Data treatment, tin and lead concentrations in majolica pottery production, 383-384 Defixiones. See Curse tablets Deh Luran Plain, ceramic glaze samples for compositional analysis, 424-427,434,436 137,440 Depth profiling, coating samples from Little Lost River Cave, 162-163 Detection limits in LA-ICP-MS protocol testing copper alloy analysis, 341 Wari ceramics elemental analysis, 353-354/... 

The soil depth profile was sampled 600 m to the Southwest of the Hettstedt metallurgical works from a clayey soil (>35% clay) of the Wipper meadow. Fig. 9-12 shows that the heavy metal emission in the Hettstedt district originated from the copper metallurgical industry [UMWELTBUNDESAMT, 1991]. The heavy metal emission was at a maximum in 1983 and 1985 and is nowadays at a low level because of the closure of most of the emitters. As would be expected from the high values of heavy metal dust emission in recent years, high soil concentrations were found for the elements zinc, copper,... 

Figure 2. SIMS in depth profile of carbon (polyimide) and Copper introduced during RF sputter cleaning.

The composition depth profiles obtained from XPS data of the composition-ungraded and graded films in the case of a copper electrode used are given in Figure 21.5. 

Figure 21.5 The depth profiles of the composition ungraded and graded (layered by single electrode process) films prepared by using copper electrode.

The effect of the hydrogen pretreatment on the concentration profiles of the constituents is presented in Fig. 4.1 IB. The depth profile measurements indicate a drastic enrichment of copper in the surface and subsurface region. The copper... 

Figure 21-11 gives a depth profile for the copper-nickel alloy described in the previous sectitrn (Figure 21-8). Here, the ratios of the peak intensities for copper versus nickel are recorded as a function of sputtering time. Curve A is the profile for the sample that had been pa.ssivated by anodic oxidation. With this sample, the copper-to-nickel ratio is essentially zero for the first 10 minutes of sputtering, w hich corresponds to a depth of about SO nm. The ratio then rises and approaches that for a sample of alloy that had been chemically etched so that its surface is approximately that of Ihe bulk sample (curve C). The profile for the nonpassivated sample (curve B) resembles that of the chemically etched sample, although some evidence is seen for a ihin nickel oxide coating.

Figure 2 Depth profiles for major nufrienfs (nifrafe (Pacific only), phosphate, and silicic acid) and filterable concentrations (that passing a 0.4-nm filter) of frace nufrienf elemenfs (zinc, cadmium, nickel, copper, and manganese) in the central North Pacific (diamonds, 32.7° N, 145.0° W, Sep. 1977) and North Atlantic (squares, 34.1° N, 66.1 °W, Jul. 1979). Manganese concentrations in the Pacific were analyzed in acidified, unfiltered seawater samples. The units molkg are defined as moles per kilogram of seawater. Data from Bruland KW and Franks RP (1983) Mn, Ni, Cu, Zn and Cd in the western North Atlantic. In Wong CS, Boyle E, Bruland KW, Burton JD, and Goldberg ED (eds.) Trace Metals in Sea Water, pp. 395-414. New York Plenum.

Figure 2 North Pacific surface waters dissolved Cu(ll) speciation (A) depth profile of Li, the stronger copper-complexing organic ligand (B) dissolved Cu(ll) depth profile ...

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