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Cooling system of electronic devices

The first part of this book deals with the characteristics of flow and heat transfer in the channels and comparison between conventional size and micro-channels, which are important to understanding micro-processes in cooling systems of electronic devices with high power density and many other applications in engineering and technology. [Pg.3]

For a while now, the problem of flow and heat transfer in heated capillaries has attracted attention from a number of research groups, with several applications to engineering. The knowledge of the thermohydrodynamic characteristics of capillary flow with evaporative meniscus allows one to elucidate the mechanism of heat and mass transfer in porous media, to evaluate the efficiency of cooling system of electronic devices with high power density, as well as to optimize MEMS. [Pg.349]


See other pages where Cooling system of electronic devices is mentioned: [Pg.2]    [Pg.7]    [Pg.8]    [Pg.10]    [Pg.12]    [Pg.14]    [Pg.16]    [Pg.18]    [Pg.20]    [Pg.22]    [Pg.24]    [Pg.26]    [Pg.28]    [Pg.30]    [Pg.32]    [Pg.34]    [Pg.36]    [Pg.38]    [Pg.40]    [Pg.42]    [Pg.44]    [Pg.46]    [Pg.48]    [Pg.50]    [Pg.52]    [Pg.54]    [Pg.58]    [Pg.60]    [Pg.62]    [Pg.64]    [Pg.66]    [Pg.68]    [Pg.70]    [Pg.72]    [Pg.74]    [Pg.76]    [Pg.78]    [Pg.80]    [Pg.82]    [Pg.84]    [Pg.86]    [Pg.88]    [Pg.90]    [Pg.92]    [Pg.94]    [Pg.96]    [Pg.98]    [Pg.100]    [Pg.103]   
See also in sourсe #XX -- [ Pg.349 , Pg.403 , Pg.422 , Pg.430 ]




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