Conducting glue

Many years later in Singapore, we were using a specially formulated thermally conductive glue to fix the overtemperature sensing thermistor smack on to the very plastic body of the TO-220 power transistor. We had empirically ascertained that in this way, the junction temperature and the adjacent temperature as seen by the thermistor were less than 10°C apart, even during an abnormal event. So if, for example, we wanted to have the transistor turned off just before it hit 150°C, we simply needed to set the trip temperature (of the thermistor-based circuit) at about 140°C. In that way, we could also be sure that we wouldn t encounter nuisance tripping on a particularly hot day, when the temperature inside the enclosure would also be much higher. 

Samples for high-angle scanning electron microscopy (SEM) (to verify PGDTEM images) were fastened onto metal stubs with conductive glue, placed in a Denton DV7502 vacuum evaporator, and pumped down to less than 10 6 Torr. The surfaces... 

Figure 3a presents the method of implementation of the electrodiffusion process with fixed polarization. The role of the solid electrode here is served by electrically conductive glue layer resistant to high temperatures. Figure 3b shows refractive index profiles of planar waveguides produced by the electrodiffusion processes for different values of electric field intensity. The durations of these processes are almost the same. Each process has been carried out at the temperature T = 300°C. For comparison the refractive index profile of the waveguide produced in the same conditions (time and temperature) in the diffusion process (Ej.=0) is presented. The presented refractive index profiles have been determined for the wavelength A = 677 nm. 

Luo, J. Y, V. C. Tung, A. R. Koltonow, H. D. Jang, and J. X. Huang. 2012. Graphene oxide based conductive glue as a binder for ultracapacitor electrodes. Journal of Materials Chemistry 22 12993-12996. 

Figure 16.2.8 Scheme of an Au-NEE prepared using a track-etched polycarbonate membrane as template (A). Particular of the section of the active area (B) top view (C) section of the aU NEE ready for use as working electrode, (a) Track-etched golden membrane (b) copper adhesive tape with conductive glue to connect to instrumentation (c) aluminum adhesive foil with non-conductive glue (d) insulating tape. Note Some dimensions are only indicative and not in scale. 

Electrochemical regeneration of the membrane was attempted after the membrane was used. When an increasing current was apphed on a test membrane, the carbon starts to bum at 100 ttiA cmrent. Hence, the electric current far below this failure limit was used. To apply the cmrent, the single core cables were attached to the feed side membrane surface with conductive glue that was heat cured at 65-70°C or 10 min. The permeation test results are given in Table 4.7 and Fig. 4.22. 

A piece of copper adhesive tape (5 x 60 mm) with conductive glue (Ted Pella, Inc.) is first affixed on a small adhesive nonconductive aluminum square and then to the lower Au coated surface of a 5 x 5 mm piece of peeled membrane, so that only a small part is in contact with the copper tape. (This is because the conductive glue on the copper tape contains Ni particles which could damage the gold layer ). 

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