Composite deposition technology

In Composite Deposition technology (CD process) [96], the filler metal for joint formation is derived from a composite powder, a compound consisting of potassium fluoroaluminate flux and Al-Si alloy. The CD powder is deposited selectively and accurately on heat-exchanger components prior to assembly and brazing. 

In the RSDT process, the steps for infroducing cafalysf, ionomer, and carbon into the gas mix are decoupled and can be independently controlled in such a manner that the Pt/C and ionomer/C ratios can be continuously modified during fhe deposition process. Reactive spray deposition technology has the capacity and flexibility required to produce compositionally and... 

The electrodeposition technology has proven to be the least expensive, effective, and readily adoptable method to deposit Ag substrates for reliable SERS substrates with good reproducibility. It allows the preparation of nanostructure patterns by controlling the amount of composition, deposition time, temperature, and applied potential. The SERS substrates prepared by electrodeposition were a good candidate for the fabrication of a reproducible substrate. In principle, most of the metals including Au [55], Cu [56], and Ag [57-59] can be electrodeposited from aqueous solutions. 

Figure Metal particle catalyzed and laser assisted chemical vapor deposition. Left Chemical vapor deposition causes the formation of a film or coating on a hot surface. Center and right Metal catalyzed and laser assisted chemical vapor deposition causes the formation of a potentially continuous fiber with a diameter corresponding to the hot metal catalyst particle or laser focus respectively. Redrawn from F. T. Wallenberger, P. C. Nordine and M. Boman, Inorganic fibers and microstructures directly from the vapor phase, Composites Science Technology, 5,193-222 (1994).

The composition of an optoelectronic memory card (eg. Laser Card of Drexler Technology Corp.) (162) is outlined in Figure 21 (163). Primary elements are polycarbonate foils with thicknesses of 250 to 400 )Tm, respectively, that are employed because of their high operating temperature and their good mechanical, optical, and dielectric characteristics. The OMC can be used as a ROM or a WORM media. Both possibiUties of information deposition can be used separately or in combination. 

The chemical and electronic properties of elements at the interfaces between very thin films and bulk substrates are important in several technological areas, particularly microelectronics, sensors, catalysis, metal protection, and solar cells. To study conditions at an interface, depth profiling by ion bombardment is inadvisable, because both composition and chemical state can be altered by interaction with energetic positive ions. The normal procedure is, therefore, to start with a clean or other well-characterized substrate and deposit the thin film on to it slowly at a chosen temperature while XPS is used to monitor the composition and chemical state by recording selected characteristic spectra. The procedure continues until no further spectral changes occur, as a function of film thickness, of time elapsed since deposition, or of changes in substrate temperature. 

---