Colloidal nanoparticles electron beam lithography

On detailed electrical characteristics of a SET transistor utilizing charging effects on metal nanoclusters were reported by Sato et al. [26]. A self-assembled chain of colloidal gold nanoparticles was connected to metal electrodes, which were formed by electron-beam lithography. The cross-linking of the particles as well as their connection to the electrodes results from a linkage by bifunctional organic molecules, which present the tunnel barriers. 

Particularly in 2D systems, control over the self-assembly of colloidal templates has offered a versatile way to produce patterned surfaces or arrays with a precision of few nanometres. Diblock copolymer micellar nanolithography (dBCML) is a versatile method that uses homopolymers or block copolymers for the production of complex surface structures with nanosized features [69], In contrast to other approaches like electron-beam lithography (EBL) and photolithography, dBCML does not require extensive equipment. In fact, it is commonly used in the fabrication of data storage devices and photonic crystals, in catalyses [70], and for the design of mesoporous films and nanoparticle arrays [71]. 

Lithography techniques such as nanosphere lithography and electron-beam lithography are ideal methods to fabricate the reproducible SERS substrates [51]. They have been shown to improve the substrates performance by controlling the size and shape of colloidal nanoparticles and interparticle spacing [52]. Lithography techniques are simple to implement and of low cost. These advantages make them suitable platforms for the fabrication of SERS-active substrate. 

Common methods for the fabrication of metallic nanoparticle arrays are electron beam lithography, photolithography, laser ablation, colloidal synthesis, electrodeposition and, in recent time, nanosphere lithography for which a monodisperse nanosphere template acts as deposition mask. A review on advances in preparation of nanomaterials with localized plasmon resonance is given in [15]. 

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