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Chambers, processing cluster tool

Fig. 2. Vacuum processing chamber configuration (a) batch coater (b) load-lock coater (c) in-line coater (d) cluster tool (e) roU coater (batch) and (f) roU coater (air-to-air), [[ccsq]] represents the isolation valve with transfer tooling [[artl]], the motion of fixturing and [[art2]], the access door. Fig. 2. Vacuum processing chamber configuration (a) batch coater (b) load-lock coater (c) in-line coater (d) cluster tool (e) roU coater (batch) and (f) roU coater (air-to-air), [[ccsq]] represents the isolation valve with transfer tooling [[artl]], the motion of fixturing and [[art2]], the access door.
The cluster tool system, which is used extensively in semiconductor device processing, uses a central introduction chamber from which the substrates may be moved into separate processing modules through load-locks and transfer tooling. These processing modules may... [Pg.99]

Cluster tool (semiconductor processing) An integrated processing system that is environmentally isolated so that, with an appropriate transport mechanism, the substrate can be moved from one processing chamber to another. Typically, the transport can be used to position the substrate randomly in processing chambers clustered around a central chamber containing the transport mechanism. See also In-line deposition system. [Pg.582]

Deposition system, cluster-tool (semiconductor processing) A load-lock vacuum system that has random access to several processing modules from the loading/transfer chamber. [Pg.595]

In-line processing system An integrated processing system that uses several processing chambers connected together to sequentially process the substrates. The in-line systems are typically characterized by having the substrates moving from chamber to chamber in one direction so that substrates can be processed in each module all the time. See also Cluster tool. [Pg.637]


See other pages where Chambers, processing cluster tool is mentioned: [Pg.514]    [Pg.147]    [Pg.96]    [Pg.99]    [Pg.375]    [Pg.352]    [Pg.352]   
See also in sourсe #XX -- [ Pg.99 ]




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