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Celanese Hostaform

If formaldehyde is copolymerized with a second monomer, which is a cyclic either such as ethylene oxide and 1,3-dioxolane, end-group capping is not necessary. The copolymerization results in occasional incorporation of molecules containing two successive methylene groups, whereby the tendency of the molecules to unzip is markedly reduced. This principle is made use of in the commercial products marketed as Celcon (Celanese), Hostaform (Farbwerke Hoechst), and Duracon (Polyplastic). [Pg.487]

Manufacturers and trade names Asahi Kasei Corporation Tenac C , Celanese Celcon , Celanese Hostaform , Mitsubishi Engineering-Plastics lupital . [Pg.94]

Figure 3.30 Stress vs. strain for Celanese Hostaform C 9021— general purpose grade acetal copolymer resin. Figure 3.30 Stress vs. strain for Celanese Hostaform C 9021— general purpose grade acetal copolymer resin.
Figure 3.40 Shear modulus vs. temperature for Celanese Hostaform acetal copolymer resins with different amounts of glass fiber reinforcement. Figure 3.40 Shear modulus vs. temperature for Celanese Hostaform acetal copolymer resins with different amounts of glass fiber reinforcement.
Figure 3.54 Mechanical loss factor d of Celanese Hostaform C 9021 as a function of temperature torsional oscillation test DIN 53 445 [5]. Figure 3.54 Mechanical loss factor d of Celanese Hostaform C 9021 as a function of temperature torsional oscillation test DIN 53 445 [5].
Figure 3.63 Ball Indentation hardness vs. temperature for Celanese Hostaform C 9021 general purpose acetal copolymer resin (ISO 2039, Part 1) [5]. Figure 3.63 Ball Indentation hardness vs. temperature for Celanese Hostaform C 9021 general purpose acetal copolymer resin (ISO 2039, Part 1) [5].
Figure 3.69 Change in length vs. water absorption for Celanese Hostaform C 9021—general purpose acetal copolymer resin. Figure 3.69 Change in length vs. water absorption for Celanese Hostaform C 9021—general purpose acetal copolymer resin.
Figure 3.77 Effect of temperature on the relative permittivity (dielectric constant) of Celanese Hostaform POM-Co (measured at 10 Hz) [5]. Figure 3.77 Effect of temperature on the relative permittivity (dielectric constant) of Celanese Hostaform POM-Co (measured at 10 Hz) [5].
Figure 3.81 Dissipation factor vs. temperature at 10 Hz for Celanese Hostaform acetal copolymer resin [5]. Figure 3.81 Dissipation factor vs. temperature at 10 Hz for Celanese Hostaform acetal copolymer resin [5].
Figure 5.12 Fluctuating stress amplitude versus cycles to failure at 23°C and 10 Hz (test specimen 3 from ISO 3167) for Celanese Hostaform C 9021—standard injection molding grade POM-Co [7],... Figure 5.12 Fluctuating stress amplitude versus cycles to failure at 23°C and 10 Hz (test specimen 3 from ISO 3167) for Celanese Hostaform C 9021—standard injection molding grade POM-Co [7],...
Table 5.21 Wear and Dynamic Coefficient of Friction of Various Celanese Hostaform Grades in Dry Sliding Contact With a Rotating Polished Steel Shaft... Table 5.21 Wear and Dynamic Coefficient of Friction of Various Celanese Hostaform Grades in Dry Sliding Contact With a Rotating Polished Steel Shaft...

See also in sourсe #XX -- [ Pg.112 , Pg.115 , Pg.119 , Pg.120 , Pg.121 , Pg.122 , Pg.123 , Pg.124 , Pg.127 ]




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