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Case Study Megasonic Post-CMP Cleaning of Thermal Oxide Wafers

6 CASE STUDY MEGASONIC POST-CMP CLEANING OF THERMAL OXIDE WAFERS [Pg.499]

In this section, a case study is presented in which polished thermal oxide wafers were cleaned using megasonic cleaning and SCI chemistry. The effects of sonic power, temperature, and oxide etching on cleaning efficiency are examined. [Pg.499]



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Cases cleaning

Cleaning wafers

Megasonic cleaning

Oxidation studies

Oxidative studies

Oxide studies

Post Oxidation

Post-CMP cleaning

Thermal oxidation

Thermal oxidation studies

Thermal oxides

Thermal study

Wafers

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