Brief History of CMP Systems

FIGURE 3.5 Schematic illustration of the evolution of CMP tools from stand-alone, dry-in/dry-out to those with advanced process control (APC). 

FIGURE 3.6 Schematic illustration of various CMP tool designs including multihead system (left), single head and platen system (center), multitable system (right), built-in single-wafer post-CMP cleaning system (bottom), and a small table and linear belt model (top). 

FIGURE 3.7 Schematic illustration of different types of polishers rotary with multitable and multihead (1), small head (2), small table (3), linear motion type (4), fixed abrasive type (5), and grinding t5 pe (6). 

FIGURE 3.8 Schematic illustration of a polisher with the integrated cleaning. The concept of dry-in/dry-out is illustrated here. 

---

Figure 3.5 shows a brief history of CMP systems. By and large, the CMP tools today have evolved from a typical polisher that was used for bare Si polishing, which was a stand-alone unit without postcleaning and drying. 

---