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Brass model compounds

The role of silica-only systems on adhesion has been studied using model compounds with squalene [59]. It was shown that the mechanism for increased adhesion to brass-coated wire-to-rubber was not just a simple improvement of the physical properties of the rubber, but that silica moderated the thickness and composition of the interfacial layer by a chemical interaction. SEM-EDX (scanning electron microscopy with energy dispersive analysis of X-rays), XPS, AES and PIXE (proton induced X-ray emission spectroscopy) revealed that silica affected the relative concentrations of compounds present in the interfacial layer, promoting zinc oxide formation in particular. [Pg.208]

In sub.sequent work [20-22] van Ooij developed the use of model compounds (in the case of natural rubber,. squalene) to simulate the physical and chemical interactions at the interface of the brass/natural rubber. system. Cuts in a tire carcass may lead to exposure of the steel/brass interface and the galvanic effects that give rise to dezincification may then become important [23]. The use of duplex Zn-Ni on Zn-Co alloys as replacements for brass has been propo.sed in order to... [Pg.789]

Recently, van Ooij et al. have reviewed adhesion of steel tire cord to rubber (van Ooij et al., 2009). The authors reviewed the literature extensively and provided an updated model for adhesion to brass-plated tire cord, which incorporated observations made by many techniques. They discussed the effects of different compounding ingredients and the possible alternatives to the current brass coatings. They note that the use of cobalt compounds improves the adhesion between rubber and brass-coated cords, but new adhesion promoters have been developed as replacements for Co, or for combined use with Co. They also discussed the use of phenolic-resin adhesion promoters. They describe the various techniques that have been developed to study the rubber-brass interface and its aging mechanism. [Pg.358]


See other pages where Brass model compounds is mentioned: [Pg.165]    [Pg.22]    [Pg.58]    [Pg.168]    [Pg.182]    [Pg.184]    [Pg.42]    [Pg.61]   
See also in sourсe #XX -- [ Pg.789 ]




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