Bonding equipment induction heating

There are two electromagnetic processes in use today induction and dielectric. Induction is more widely used, and there are several equipment manufacturers that will provide individual heaters or complete bonding systems. Dielectric heating, primarily microwave heating, is less utilized but is finding application in certain niche markets. 

Both induction and dielectric heating involve relatively expensive capital equipment outlays, and the bond area is limited. Their most important advantages are assembly speed and the fact that an entire assembly does not have to be heated to cure only a few grams of adhesive. 

---