Avionic Multichip Module

Avionic multichip module. (Courtesy of Teledyne Electronic Technologies. DuPont Application Note Reference H-65353.)... 

Hagge, J.K. 1992. State-of-the-art multichip modules for avionics. IEEE Trans. Comp., Hybrids, and Manuf. Technol. 15(1) 29-41. 

This thick-film multichip module substrate (Figure 1.22) packaged the row and column driver circuits for an electroluminescent avionics flat panel cockpit display. The three-conductor-layer substrate is 86.4 x 111.8 mm (3.4 X 4.4 in.) in size with 43 metallized through vias in the alumina substrate for interconnections on both sides of the substrate. On the component side, the 14 row and column driver ICs are aluminum-wire-bonded with a total... 

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