Automation thermal analysis system reaction

An Automated Thermal Analysis System for Reaction Kinetics," A.F. Kah, M.E. Koehler, T.H. Grentzer, T.F. Niemann, and T. Provder, Computer Applications... 

Kah, A. F. Koehler, M. E. Grentzer, T. H. Niemann, T. F. Provder, T. "An Automated Thermal Analysis System for Reaction Kinetics" in "Computer Applications in Applied Polymer Science" Provder, T., Ed. ACS SYMPOSIUM SERIES No. 197, American Chemical Society Washington, D.C., 1982 pp. 197-311. 

An Automated Thermal Analysis System for Reaction Kinetics... 

A DuPont Model 990 Thermal Analysis Console with Model 910 DSC accessory was interfaced to a minicomputer system by means of a microcomputer for automated data collection. A program to provide the analysis of reaction kinetics data by the single dynamic scan method for DSC kinetics was developed. Features of this program include a fit of the data to a single equation by multiple regression techniques to yield the reaction order, the energy of activation and the Arrhenius frequency factor. The rate constant k(T) is then calculated and conversion data as a function of time and temperature can be generated at the operator s option. 

Mathematical modeling of the cure process coupled with the automation of various thermal analytical instruments and Fourier Transform Infrared Spectroscopy (FT-IR) have made possible the determination of quantitative cure and chemical reaction kinetics from a single dynamic scan of the reaction process. This paper describes the application of FT-IR, differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) in determining cure and reaction kinetics in some model organic coatings systems. 

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