Au and Ag Metals

Some mixed Au and Ag metal complexes (filled circle, Au open circle, Ag) (a) [Au(CH2PPh2)2]2[Ag(0C103)2]2,... 

Zhao, G., H. Kozuka and T. Yoko (1996). Sol-gel preparation and photoelectrochemical properties of Ti02 films containing Au and Ag metal particles. Thin Solid Films, 277(1-2), 147-154. 

The short Au Ag contacts may be due to some degree of metal-metal bonding which means that these were the first reported Au—Ag bonds. The complexes with acetone and acetonitrile shown are also the first reported examples in gold chemistry in which the pentafiuorophenyl ligands act as a bridge between Au and Ag centers. This type of behavior is generally more common in Pt chemistry. 

Elemental association can be used to sub-classify these deposits. Major metal elements produced from Kuroko deposits are Cu, Pb, Zn, Ba, Ca, Fe, Au, and Ag. Average ore grade and tonnage are summarized in Table 1.1. Horikoshi and Shikazono (1978) classified Kuroko deposits into three sub-types C sub-type (composite ore type). 

Major epithermal vein-type deposits in Japan are base-metal type and precious-metal type which are classified based on the ratios of base metals and Au and Ag which have been produced during the past (Table 1.2). 

The ore deposits can be classed into two types based on the types of associated metals Au-Ag rich deposits (Type A) from which An and Ag are produced as main products, and base metal (Cu, Pb, Zn, Mn, (Sn), (W), (Bi), (Mo), (Sb)) rich deposits (Type B) from which Au and Ag are recovered as byproducts. The deposits are associated with felsic and intermediate volcanic rocks but generally not with felsic plutonic rocks. In Japan Au-Ag deposits associated with granitic rocks (e.g., Au-Ag vein-type deposits in Kitakami) occur commonly. However, these plutonic-type deposits are not described here. 

The total production of gold, silver and other associated base metals and silver/ gold production ratios from these deposits are summarized in Table 1.17. In addition to gold and silver, lead, zinc and manganese have been produced from some of the Se-type (e.g., Yatani) and copper has been produced from some of the Te-type (e.g., Teine, Kawazu). Total tonnage of production of Au and Ag from the Se-type is greater than... 

As noted already, epithermal vein-type deposits are classified primarily on the basis of their major ore-metals (Cu, Pb, Zn, Mn, Au and Ag) into the gold-silver-type and the base-metal-type. Major and accessory ore-metals from major vein-type deposits in Japan were examined in order to assess the possible differences in the metal ratios in these two types of deposits (Shikazono and Shimizu, 1992). Characteristic major ore-metals are Au, Ag, Te, Se and Cu for the Au-Ag deposits, and Pb, Zn, Mn, Cu and Ag for the base-metal deposits (Shikazono, 1986). Accessary metals are Cd, Hg, Tl, Sb and As for the Au-Ag deposits and In, Ga, Bi, As, Sb, W and Sn for the base-metal deposits (Table 1.22, Shikazono and Shimizu, 1992). Minerals containing Cu, Ag, Sb and As are common in both types of deposits. They are thus not included in Table 1.22. 

They indicated that the softness parameter may reasonably be considered as a quantitative measure of the softness of metal ions and is consistent with the HSAB principle by Pearson (1963, 1968). Wood et al. (1987) have shown experimentally that the relative solubilities of the metals in H20-NaCl-C02 solutions from 200°C to 350°C are consistent with the HSAB principle in chloride-poor solutions, the soft ions Au" " and Ag+ prefer to combine with the soft bisulfide ligand the borderline ions Fe +, Zn +, Pb +, Sb + and Bi- + prefer water, hydroxyl, carbonate or bicarbonate ligands, and the extremely hard Mo + bonds only to the hard anions OH and. Tables 1.23 and 1.24 show the classification of metals and ligands according to the HSAB principle of Ahrland et al. (1958), Pearson (1963, 1968) (Table 1.23) and softness parameter of Yamada and Tanaka (1975) (Table 1.24). Compari.son of Table 1.22 with Tables 1.23 and 1.24 makes it evident that the metals associated with the gold-silver deposits have a relatively soft character, whereas those associated with the base-metal deposits have a relatively hard (or borderline) character. For example, metals that tend to form hard acids (Mn +, Ga +, In- +, Fe +, Sn " ", MoO +, WO " ", CO2) and borderline acids (Fe +, Zn +, Pb +, Sb +) are enriched in the base-metal deposits, whereas metals that tend to form soft acids... 

In contrast, in Southwest Japan, polymetallic veins (so-called xenothermal-type deposits in the sense of Buddington (1935) or subvolcanie hydrothermal type in the sense of Cissartz (1928, 1965) and Schneiderhohn (1941, 1955) occur. Examples of these deposits are Ashio, Tsugu, Kishu and Obira. All these vein-type deposits have formed at middle Miocene age in western part of Tanakura Tectonic Line under subaerial environment. In these deposits, many base-metal elements (Sn, W, Cu, Pb, Zn) and small amounts of Au and Ag are concentrated. These deposits are associated with felsic volcanic and plutonic rocks along the Median Tectonic Line (MTL) or south of MTL. 

Most of these examples show that it is apparently easier to grow ordered arrays of more reactive metals, for example, Pd, than unreactive metals such as Au and Ag. This is most likely due to the low interaction energy of the latter metals with the oxide surfaces and, consequently, a lower specificity of the traps. This calls for a modification of the template to increase the interaction energy of the template sites (traps) with the deposited metals. 

Among the various types of composite systems, that of the metal-support ranks as one of the most important, because of its crucial role in catalysis. The situation under consideration is that of chemisorption on a thin metal him (the catalyst), which sits on the surface of a semiconductor (the support). The fundamental question concerns the thickness of the film needed to accurately mimic the chemisorption properties of the bulk metal, because metallization of inexpensive semiconductor materials provides a means of fabricating catalysts economically, even from such precious metals as Pt, Au and Ag. 

Underpotential deposition is described as less than monolayer metal deposition on a foreign metal substrate, which occurs at more positive potentials than the equilibrium potential of a metal ion deposed on its own metal, expressed by the Nemst equation. Kolb reviewed state-of-the-art Underpotential deposition up to 1978. As Underpotential deposition is a process indicative of less than a monolayer metal on a substrate, it is expected to be quite sensitive to the surface stmcture of the substrate crystal a well-defined single-crystal electrode preparation is a prerequisite to the study of Underpotential deposition. In the case of Au and Ag single-crystal electrodes, Hamelin and co-workers extensively studied the necessary crystal surface structure, as reviewed in Ref. 2. 

Fig. I. Methods for forming metal vapors, (a) Evaporation from a resistance-heated, alumina-coated Mo or W spiral. This is a method suitable for Cr, Mn, Fe, Co, Ni, Cu, Pd, Ag, Au and other metals that do not attack alumina, (b) Evaporation from a resistance-heated Ta or W boat. This method is useful for V, Cr, and some lanthanides, (c) Sublimation from a resistance-heated free-hanging loop of wire, e.g., Ti, Mo, or W. (d) Evaporation from a cooled hearth using laser or electron bombardment heating. This method may be used with all metals.

When investigating transition metals, Ozin et al. made the first attempts with Au and Ag atoms [31], and observed very labile MC02 n complexes by means of... 

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