Applications of Bismaleimide Resins

T j = temperature corresponding to maximum rate of weight loss T.. = temperature corresponding to 50% weight loss [Pg.131]

Bismaleimide resins are extensively used in multilayer printed circuit boards. They can also be used in insulation fibres for protective clothing. Due to their ability to adhere and retain adhesive strength at high temperature, bismaleimides are widely used as a base material for flexible printed circuit boards in the electrical and electronics industries. Bismaleimides are often linked with rubber chains for use as flexible linking molecules to reinforce the rubber compound for tyre applications. The double bond of bismaleimides readily reacts with all hydroxy or thiol groups found on the matrix to form a stable carbon-sulfur, carbon-nitrogen or carbon-carbon bond. [Pg.132]