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Annealing after

Fabrication of pure rhenium is done cold with recrystallization annealing after each 10—40% reduction, depending on the operation and size. Annealing of Mo—Re and W—Re products is also necessary. [Pg.163]

Before annealing After annealing (200°C, Lmin, silicon bath)... [Pg.841]

At temperatures above 300°C, low-carbon nickel (0-02% C) is preferred to avoid the possibility of intergranular attack developing after long exposure if material of higher carbon is employed it should be annealed after fabrication and before exposure to caustic alkalis to prevent stress-assisted intergranular corrosion. [Pg.791]

Alloy 600 Alloy 400 Caustic alkalis, high concentrations and high temperature Usually IG Anneal after fabrication... [Pg.795]

Fig. 3. Forward (top) and reverse (bottom) voltages of InGaN/GaN MQW LED with and without annealing after etching as a function of ICP source power. Fig. 3. Forward (top) and reverse (bottom) voltages of InGaN/GaN MQW LED with and without annealing after etching as a function of ICP source power.
Stress corrosion cracking can be avoided by selecting materials that are not susceptible in the specific corrosion environment or, less certainly, by stress relieving by annealing after fabrication and welding. [Pg.291]

As it is essential to remove all the oil and grease on the copper before coating, the part is first alkaline cleaned, degreased, or annealed. After cleaning, the part is then typically pickled for oxide removal. [Pg.310]

FIGURE 15.25 IR spectra of SWNTs (a) p-SWNTs, (b) after peroxytrifluoroacetic acid treatment, and (c) N2 annealing after treatment. (Reprinted with permission from [158], Copyright (2005) Elsevier.)... [Pg.513]

Fig. 9. Hole mobility versus temperature for an InP Zn epilayer grown by OMVPE. a) before any hydrogenation, b) after hydrogen plasma for 6 hours at 200°C followed by a 275°C, 5 min. annealing. After hydrogenation, the InP layer is highly resistive and Hall measurements are difficult. The slight annealing is performed to partially reactivate the zinc acceptors to a value of 1.3 x 1016 cm-3, which makes possible Hall measurements. J. Cheval-lier et al., Materials Science Forum, 38-41, 991 (1989). Trans. Tech. Publications Semicond. Sci. Technol. 4, 87 (1989). IOP Publishing Ltd. Fig. 9. Hole mobility versus temperature for an InP Zn epilayer grown by OMVPE. a) before any hydrogenation, b) after hydrogen plasma for 6 hours at 200°C followed by a 275°C, 5 min. annealing. After hydrogenation, the InP layer is highly resistive and Hall measurements are difficult. The slight annealing is performed to partially reactivate the zinc acceptors to a value of 1.3 x 1016 cm-3, which makes possible Hall measurements. J. Cheval-lier et al., Materials Science Forum, 38-41, 991 (1989). Trans. Tech. Publications Semicond. Sci. Technol. 4, 87 (1989). IOP Publishing Ltd.
Figure 1. a) Cyclic voltammetry curve recorded from a UHV prepared, well-annealed Pt(lll) crystal in dilute HF electrolyte. Crystal was immersed under potential control at 0.6 V (RHE) and swept cathodically to the limiting potential b) same experiment performed with the same crystal but not annealed after ion bombardment. [Pg.39]

Dislocations multiply in a facile manner during a plastic deformation process, and several mechanisms for this have been observed by electron miscroscopy. Dislocations are destroyed by the processes of recovery and recrystallization during annealing after plastic deformation. Since dislocations cause low-yield stresses in metals and other solids, solid strengthening is accomplished either by eliminating dislocations or by immobilizing them. [Pg.245]

Tenite 3310 annealed after irradiation. Other symbol designations as... [Pg.156]

Some galvanized sheets are annealed after dipping in order to form a coaling consisting entirely of iron-zinc compounds, a process which lends to increase resistance to peeling. [Pg.703]

Several problems are associated with the reactor shell. Few workshops have annealing furnaces suitable for large reactors. Thus, to avoid annealing after welding and to keep the weight for transportation... [Pg.58]

Recommended bellows material INCONEL 625 Grade 2 (LCF) - annealed after forming or HAYNES ALLOY 230. ASTM B435 UNS N06230 is preferred above 650 °C but is rather expensive. [Pg.227]

Answer Hydrophobic interactions are the driving force for membrane formation. Because these forces are noncovalent and reversible, membranes can easily anneal after disruption. [Pg.110]


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See also in sourсe #XX -- [ Pg.117 ]




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