Aluminum alloys, plasma etching

Corrosion. Aluminum is a not a noble metal and is attacked by both alkali and acidic solutions. Because of the presence of a surface A1203 film, the metal is protected against corrosion [Diggle et al.136, Borgmann et al.137]. This oxide film, however, is easily penetrated, for instance, by the presence of chlorine ions which remain in the resist after a chlorine based plasma etch. Also, the presence of Cu in the aluminum weakens the corrosion resistance of the alloy by the presence of an unfavorable electrochemical couple (A1/Cu2+). 

In special cases where the surface hardness must be increased or chemical corrosion resistance is necessary (e.g. plasma etching with chlorine), anodized aluminum surfaces can be useful. Alloying elements, impurities, and heat treatment can influence the nature and quality of the anodized coating - typically, the more pure the aluminum alloy, the better the anodized layer. To build up a thick anodized layer on aluminum, it is necessary for the electrolyte to continuously corrode the oxide, producing a porous oxide layer. ASTM Specification B-580-73 designates seven thicknesses (up to 50 microns) for anodization. 

Aluminum is often used as an alloy with a few atomic % Si and/or Cu to reduce electromigration (Fig. 1). This alloy is difficult to etch because copper does not form readily volatile compounds [73]. Fleating of the wafer to some 200 °C and intense ion bombardment to sputter off involatile products are then necessary to effect etching. Residual chlorine remaining on the wafer after aluminum etching can be deleterious because it can promote corrosion, especially in Al-Cu alloys. Hence wafer rinsing with DI water is common. Dry passivation by exposure to a fluorocarbon plasma has... 

---