Adhesives in Semiconductor Technology

Adhesives for semiconductor parts have been developed. The compositions include COCs. The materials are either derived from ROMP and subsequent hydrogenation or from addition polymerization (69). 

The polymers are further modified by allyl alcohol, trimethoxy-vinylsilane, allyl glycidyl ether, or maleic anhydride. The functionalization is effected by dicumyl peroxide. 

Here the joining of an adhesive bonding a tape carrier package, in which a semiconductor chip has been incorporated, to a liquid crystal display panel through an anisotropic conductive film is shown. 

The adhesive film is laminated onto the surface of the substrate, by placing a semiconductor part on the adhesive film, bonding the semiconductor part to the substrate by heating typically up to 190°C and pressurizing. 

Eventually, the adhesive film is cooled. Typically a bonding strength of 90-130 kp cm 2 is obtained, which does not significantly alter its properties after 6 months. 

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