Conductive adhesives alternative advantages

The substrate material is exposed to relatively high localized temperature loading, particularly when SnAgCu solder is used. An alternative connection medium would be a conductive or nonconductive adhesive, which cures at a much lower temperature and does not call for a matched temperature profile. An adhesive can be made conductive by the admixture of electrically conductive metallic or metallized particles. These adhesives can work at steady-state temperatures in the range from 150 to 170 °C. Another advantage is the availabihty of hard and soft adhesives, so the choice can be matched to connection technology to afford optimum long-term reliability. 

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