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A Road map of 2.5-D Integration

Institute of Microelectronics, Tsinghua University Beijing 100084, P. R. China, dengyd tsinghua.edu.cn [Pg.144]

Electrical and Computer Engineering Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3891 USA, maly ece.cmu.edu [Pg.144]

Keywords 2.5-D Integration, stacked memory, CPU, graphics processing unit (GPU), DRAM, mixed-signal, image sensor, radar-in-cube. [Pg.144]

In the previous chapters, the feasibility of 2.5-D integration scheme has been justified through extensive design case studies. With the maturation of fabrication, [Pg.144]

5- [) integrated application-specific processor (tg., graphic processor and netmirk processor) and memory [Pg.145]

See other pages where A Road map of 2.5-D Integration is mentioned: [Pg.144]    [Pg.145]    [Pg.147]    [Pg.149]    [Pg.151]    [Pg.153]    [Pg.157]    [Pg.159]    [Pg.161]    [Pg.163]    [Pg.144]    [Pg.145]    [Pg.147]    [Pg.149]    [Pg.151]    [Pg.153]    [Pg.157]    [Pg.159]    [Pg.161]    [Pg.163]   


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3-D integration

As mapping

D mapping

Road map

Roads

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