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Wafer handling efficiency

Raw throughput improvement can be achieved by reducing the amount of material that must be polished away, increasing film removal rates, and increasing the wafer-handling efficiency. Wafer-handling efficiency is addressed in the following sections. [Pg.9]

Industrial and military needs have placed greater emphasis on improved anchor systems as operations are performed in deeper wafer and with some positioning accuracy. Additionally, anchor requirements include high anchor capacity/weight ratio, reliability, efficiency, and ease of handling and deployment These demands have led to the development of a large number of new anchor types and an assortment of theories to predict the uplift capacity of fhese anchors in differenf sedimenf fypes (Figure 10.39). This section will contain a review of fhese new anchor types and some anchor capacity theories. While the uplift pile remains an important anchor type, it was discussed in some detail earlier in this chapter. [Pg.429]


See other pages where Wafer handling efficiency is mentioned: [Pg.253]    [Pg.470]    [Pg.229]    [Pg.248]    [Pg.565]    [Pg.140]    [Pg.552]   
See also in sourсe #XX -- [ Pg.9 ]




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