Wafer bonding based 3-D integration technologies

Research Group Stacking Style Bonding Interface1 Inter-chip Contact  

Tohoku Univ.[17 18] Face-to-face or face-to-back Adhesive 1 3x3 30 

1 By bonding interface we indicate the manner in which two chips are attached. 

2 Yield Analysis of Different VLSI Integration Approaches 

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Table 2.1 Wafer bonding based 3-D integration technologies...

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