Vacuum processing chamber configuration

Fig. 2. Vacuum processing chamber configuration (a) batch coater (b) load-lock coater (c) in-line coater (d) cluster tool (e) roU coater (batch) and (f) roU coater (air-to-air), [[ccsq]] represents the isolation valve with transfer tooling [[artl]], the motion of fixturing and [[art2]], the access door.

There are several types of deposition chamber configurations (Fig. 2). The batch-type system is the most commonly used, but the requirement that the system be returned or let-up to ambient pressure on each cycle can pose problems in obtaining a reproducible processing environment. The load-lock system and the in-line system allows the deposition chamber to be kept under vacuum at all times and the substrates introduced and removed through... 

From a sample preparation point of view, it must be remembered that several of the methods may require processing in vacuum, which implies remote sample handling and manipulation from outside the test chamber. There is a wide variety of intricate commercial instrumentation available for this step, and most designs allow additional customization, depending on vacuum chamber configuration. 

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