Uncured resin, temperature scanning

Figure 4. TICA temperature scan of uncured BCB/BMI resin blend. Tan the in-phase (a) response and the out-of-phase (b) response are given as a function of temperature.

Dynamic mechanical analysis provides a useful technique to study the cure kinetics and high temperature mechanical properties of phenoHc resins. The volatile components of the resin do not affect the scan or limit the temperature range of the experiment. However, uncured samples must be... 

Differential scanning calorimetry (DSC) and thermomechanical analysis (TMA) were used to measure the glass transition temperatures (Tgs) of the uncured and cured AT-resins respectively (Figure 6). 

The higher uncured Tg of the quinoxaline resin requires a lower extent of reaction to reach the vitrification point during the scan. The cumulative effect at vitrification may not be sufficient to show different vitrification temperatures. 

Dynamic mechanical analysis provides a useful technique to study the cure kinetics and high temperature mechanical properties of phenolic resins. The volatile components of the resin do not affect the scan or limit the temperature range of the experiment. However, uncured samples must be supported by a braid, a scrim, or paper. This does not influence the kinetic results and can be corrected in the calculations of dynamic mechanical properties (qv). Recent DMA work on phenolic resins has been used to optimize the performance of structural adhesives for engineered wood products and determine the effect of moisture in wood product on cure behavior and bond strength (75-77). 

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