Trends in materials developed by relevant companies

LTCC Suppliers Products (composition) Dielectric constant ) Resistivity (Jl cni) Thermal expansion co- cfHlcient ppm/°C) Thermal conduct- ivity (w/m K) Flexural strength (MPa) 

As one example, consider the interfacial phenomenon between ceramic and copper wiring. If the material or process conditions of the ceramic and copper are inappropriate, various macro and micro flaws occur. For example, in the firing process, minute pores are formed at the interface. Possible causes of the formation of the pores are (1) mismatch of the firing and shrinkage behaviors of the conductor and ceramic, (2) insufficient adherence between the conductor and ceramic in the laminating process, (3) 

This book recognizes that the materials and processes of LTCC technology are interrelated as suggested above. It describes separately the general technical information of each material (ceramic, conductor, and resistor materials) and each process, and it offers commentaries on unique examples resulting from these interrelations. In addition, it includes basic, textbook level content on materials. 

LTCCs evolved from HTCCs with the purpose of achieving low loss, high speed, and high density packaging, as higher material performance was required for ceramic material than that offered by the alumina used for HTCCs. 

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