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Toughening mechanisms bridging

Deflection rarely operates as the sole toughening mechanism in a system, although its contribution in some systems may be significant. Crack deflection, however, is a major aspect of bridge formation processes that leads to toughening via bridging ligaments. [Pg.52]

Furthermore, the model makes it possible to separate the contributions of the three toughening mechanisms as a function of temperature (Fig. 13.6). At high temperatures, the crack-bridging mechanism plays a minor role the void-growth mechanism is very sensitive to temperature and can be completely suppressed at low temperatures. Shear yielding is the main mechanism, except at very high test temperatures where cavitation plays the major role. The contribution of shear yielding depends on the difference between the test temperature and Tg, as discussed in Chapter 12. [Pg.407]

Figure 13.6 Relative contributions (%) of the different toughening mechanisms in epoxy networks versus temperature ( ) rubber bridging ( ) shear yielding and (A) cavitation. (From the results of Huang et a ., 1993b.)... [Pg.408]

Sue et al. (1997) reported results for the same LC epoxy monomer cured with various hardeners. KIe values could be increased up to 1.89 MPa m1/2. Observations of fracture surfaces indicated that crack bridging, crack branching, and crack deflection were the main toughening mechanisms. [Pg.424]

Research into the toughening behavior responsible in the composite materials shows that crack-whisker interaction resulting in crack bridging, whisker pull-out and crack deflection are the major toughening mechanisms. [Pg.60]

Despite the fact that ceramics are inherently brittle, a variety of approaches have been used to enhance their fracture toughness and resistance to fracture. The essential idea behind all toughening mechanisms is to increase the energy needed to extend a crack, that is, in Eq. (11.11). The basic approaches are crack deflection, crack bridging, and transformation toughening. [Pg.380]


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See also in sourсe #XX -- [ Pg.422 ]




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