Three-dimensional structure poly resist

The stamp used in pCP is most commonly fabricated by photolithographic procedures. An image is transferred into a film of photoresist, the exposed resist is developed to produce a three-dimensional structure, and this structure is then covered with the prepolymer from which the stamp is to be formed (typically poly(dimethylsiloxane), PDMS). The PDMS is allowed to cure, and then peeled from the master. 

FIGURE 4 The resistance of 300 keV proton (H") implanted PPP (poly-p-phenylene) [IS]. These data combined, with the data shown in Fig. 3, indicate the percolation behavior of the resistivity as a function of dose. The percolation starts when the one-dimensional clusters come in contact with each other (this figure) and saturates when the three-dimensional carbon structures overlap (Fig. 3). 

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