Thick films shrinkage

Figure 1 shows SEM photographs of cross sectional iracture of the Feo.9jSi2.oMno,)j thick films. The melting temperature seems to be approximately 1483 K. Table 1 shows the porosity of the films. The porosity is larger than 21 vol. % at 1478 K, while porosity decreases to 0 vol. % when the film was melted at 1483 K. These results show that the substrate restricts shrinkage of the film. The porosity can be decreased down to 8 vol. % when the film is melted. 

Figure 11.50 Film shrinkage of PAR-700/A4 resist as a function of electron-beam dose. The nominal resist thickness was 400 nm.

Figure 11.37 Shrinkage kinetics for unconstrained thick film of gold particles and LTCC tape consisting of cordierite and glass particles. The data points are fitted with smooth curves. (From Ref 52.)...

The generation of micro-cracks in the electrophoretically deposited silica films during the drying process is attributed to the shrinkage of the particles as well as the capillary force. It is thus important to control the surface activity and density of the silica particles to prepare thick films with no cracks. Heat treatment of toe particles before electrophoretic... 

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