Thermosetting resins scanning calorimetry

Cure kinetics of thermosets are usually deterrnined by dsc (63,64). However, for phenohc resins, the information is limited to the early stages of the cure because of the volatiles associated with the process. For pressurized dsc ceUs, the upper limit on temperature is ca 170°C. Differential scanning calorimetry is also used to measure the kinetics and reaction enthalpies of hquid resins in coatings, adhesives, laminations, and foam. Software packages that interpret dsc scans in terms of the cure kinetics are supphed by instmment manufacturers. 

The glass transition temperatures, specific for each thermosetting resin, are used to characterize cure kinetics. They can be measured by many techniques, of which the widely used are Differential Scanning Calorimetry (DSC) and Torsional Braid Analysis (TBA)... 

Differential Scanning Calorimetry (DSC) This is by far the widest utilized technique to obtain the degree and reaction rate of cure as well as the specific heat of thermosetting resins. It is based on the measurement of the differential voltage (converted into heat flow) necessary to obtain the thermal equilibrium between a sample (resin) and an inert reference, both placed into a calorimeter [143,144], As a result, a thermogram, as shown in Figure 2.7, is obtained [145]. In this curve, the area under the whole curve represents the total heat of reaction, AHR, and the shadowed area represents the enthalpy at a specific time. From Equations 2.5 and 2.6, the degree and rate of cure can be calculated. The DSC can operate under isothermal or non-isothermal conditions [146]. In the former mode, two different methods can be used [1] ... 

This chapter describes preliminary investigation into the thermosetting process of one whey-based resin preparation using differential scanning calorimetry (DSC). 

Differential scanning calorimetry (DSC), DMA and TG were used by Tabaddor and co-workersl l to investigate the cure kinetics and the development of mechanical properties of a commercial thermoplastic/ thermoset adhesive, which is part of a reinforced tape system for industrial applications. From the results, the authors concluded that thermal studies indicate that the adhesive was composed of a thermoplastic elastomeric copolymer of acrylonitrile and butadiene phase and a phenolic thermosetting resin phase. From the DSC phase transition studies, they were able to determine the composition of the blend. The kinetics of conversion of the thermosetting can be monitored by TG. Dynamic mechanical analysis measurements and time-temperature superposition can be utilized to... 

---