Thermal stability Dynamic thermogravimetric analysis

Thermal stability is an important criterion for microelectronic applications and hence has been the focus of several studies. Figure 9 shows the dynamic thermogravimetric analysis (TGA) of Parylene-N in both inert and oxygen environments. It is clear that, Parylene-N is stable up to about 480°C in inert ambient, beyond which it gradually decomposes. 

The thermal stability of the (alkylsulfonyl)methyl-substituted polymers was evaluated from dynamic thermogravimetric analysis (TGA) under N2 (Table II). All the (alkylsulfonyl)methyl-substituted polymers were stable to 300 C. Figure 3 shows that all of the (alkylsulfonyl)methyl-substituted polymers have similar decomposition behavior their initial decomposition and half decomposition temperatures were very close. Table III shows that the side chain length does not affect the thermal decomposition behavior. Backbone structure does affect the decomposition behavior slightly. MST shows a two-step decomposition and MSEE shows the highest thermal stability (Figure 4) of the three (methylsulfonyl)methyl-substituted polymers. 

Thermal properties Thermal properties are the properties of materials that change with temperature. They are studied by thermal analysis techniques, which include DSC, thermogravimetric analysis (TGA), differential thermal analysis (DTA), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA)/dynamic mechanical thermal analysis (DMTA), dielectric thermal analysis, etc. As is well known, TGA/DTA and DSC are the two most widely used methods to determine the thermal properties of polymer nanocomposites. TGA can demonstrate the thermal stability, the onset of degradation, and the percentage of silica incorporated in the polymer matrix. DSC can be... 

Studies of the thermal and chemical stability of polymers are of paramount importance and instrumentation used in these studies discussed in Chapter 9 include thermogravimetric analysis, differential thermal analysis, differential scanning calorimetry, thermal volatilisation analysis and evolved gas analysis. Monitoring of resin cure is another important parameter in polymer processing in which dynamic mechanical analysis, dielectric thermal analysis and differential scanning calorimetry is used (Chapter 10). 

Dan and co-workers [8] studied the structures and thermal and thermo-oxidative stabilities of the gel and chlorinated natural rubber from latex. The polymers were analysed by chemical analysis, high-resolution pyrolysis-gas chromatography-mass spectroscopy (HR-Py-GC-MS) coupled with Fourier-transform infrared spectroscopy, and thermal analysis techniques [dynamic thermal analysis and thermogravimetric analysis (TGA)]. 

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