Thermal interface materials solder

P.A. Koning, F. Hua, and C.L. Deppisch, Polymer with solder precoated fillers for thermal interface materials, US Patent 7 036 573, assigned to Intel Corporation (Santa Clara, CA), May 2,2006. 

Whatever the technology used to create an optical interconnection system it must be capable of forming an effective fully interconnected stable system. An effective practical system requires a balance of material properties for a broad thermal operating range, ease of optical coupling to sources, detectors, optical fibers with industry compatible connectivity and acceptable total optical loss. Practical applications also require capability for versatile configurations and be process forgiving. For example, compatibility with common industrial assembly processes like solder reflow for electronic or E/0 component attachment and interfaces. 

---