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The distribution of wire length and temperature gradient

Design Measures of merit Area wire length driven Area, wire length thermal driven [Pg.110]

Our floorplanning tools could serve as the prototype for future 2.5-D system designs. A full-fledged 2.5-D floorplanning tool should be equipped with many new feature features described as follows. [Pg.112]

Institute of Microelectronics, Tsinghua University Beijing 100084, P. R. China, dengyd tsinghua.edu.cn [Pg.117]

Electrical and Computer Engineering Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3891 USA, maly ece.cmu.edu [Pg.117]

Abstract This chapter covers the placement solutions for 2.5-D/3-D integrated circuits. Based on a partition technique, our placement techniques could handle VLSI circuits consisting of both standard cells and macros. The detailed result analysis justifies the potential of the 2.5-D integration approach to improve system performance and lower interconnect power consumption. [Pg.117]


Figure 5.10 The distribution of wire length and temperature gradient... Figure 5.10 The distribution of wire length and temperature gradient...



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