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Substrate Preparation and Adhesion

The nature of the substrate and its predeposition treatment play a major role in determining the surface nucleation rate but not necessarily the rate of subsequent cpowth (after the immediate surface layer is deposited) The most widely used substrate is still silicon, but other mciterials [Pg.319]

The nucleation rate and the adhesion vary with the nature of the substrate and appear to be related to the ability of the substrate material to form an intermediate carbide. Surface treatments such as etching or mechanical working (scratching with a diamond powder or diamond polish) help promote adhesion. [Pg.320]


See other pages where Substrate Preparation and Adhesion is mentioned: [Pg.505]    [Pg.319]   


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Substrate preparation

Substrate, adhesion

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