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Stress-strain profile

FIGURE 1 Stress-strain profile of a material undergoing uniaxial compression. [Pg.311]

FIGURE 2 (A) Stress-strain profiles for a particle and a powder bed, (B) corresponding normalized stress-strain profiles. [Pg.312]

FIGURE 15 The difference between a brittle and ductile stress strain profile. [Pg.504]

Figure 3. Stress strain profiles at the epoxy diacrylate resin before and after aging at 200 C. Figure 3. Stress strain profiles at the epoxy diacrylate resin before and after aging at 200 C.
REDUCTION FACTORS AT ELEVATED TEMPERATURES FOR STRESS-STRAIN PROFILES... [Pg.2080]

Another characteristics feature of the glass transition is the associated change in the modulus. The stress, elongation, is related to the strain, the force applied to a material by the modulus. Conventionally there are two approaches to the measurement of the modulus static and dynamic. The static method involves measurement of the stress strain profile and from the slope of the curve the elastic modulus can be determined. The dynamic method subjects the sample to a periodic oscillation and explores the variation of the amplitude and phase of the response of the sample as a function of temperature. A small sample of the test material is subjected to displacement as shown in Figure 7.3. [Pg.181]

Figure 7.4. Stress-strain profiles of nylon 6/SWNT composite fibers at different SWNT loadings. The... Figure 7.4. Stress-strain profiles of nylon 6/SWNT composite fibers at different SWNT loadings. The...
Continuous monitoring of stress-strain profiles and the auxiliary quantities derived,... [Pg.898]

Stimuh in measurement may affect the data acquired. For example, in mechanical strength detection, the stress-strain profiles of a nanosolid may not be symmetric under tension and compression, and the flow stress is strain rate, loading mode, and materials compactness as well as size distribution dependent. However, one could not expect to cover the fluctuations of mechanical (strain rate, stress direction, loading mode, etc), thermal (self-heating during process and electron bombardment in TEM), crystal structure orientation, or grain-size... [Pg.430]

However, for plastic deformation, the competition between dislocation activation and dislocation resistance becomes dominant, which presents a difference in the plastic deformation from the elastic response in terms of the IHPR features. In the nanoindentation test, errors may arise because of the shapes and sizes of the tips. The stress-strain profiles of a nanosolid are not symmetrical when comparing the situation under tension to that under compression [112]. The flow stress is dependent of strain rate, loading mode and duration, and material compactness, as well as size distribution. These factors may influence measured data that are seen... [Pg.589]


See other pages where Stress-strain profile is mentioned: [Pg.1879]    [Pg.1880]    [Pg.507]    [Pg.432]    [Pg.437]    [Pg.352]    [Pg.445]    [Pg.319]    [Pg.236]    [Pg.2673]    [Pg.180]    [Pg.206]    [Pg.126]    [Pg.651]    [Pg.190]    [Pg.191]    [Pg.191]    [Pg.193]    [Pg.214]    [Pg.106]    [Pg.2917]   


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