Stepped interlayer delamination

Figure 7-14 Typical forms of delamination (a) vertical splitting, (b) stepped interlayer delamination, (c) circnlar delamination, (d) internal interlayer delamination, and (e) surface blistering.

Internal interlayer delamination is where delamination occurs at the interface between the internal conductor and the ceramic, although the cracks do not reach to the outside of the substrate. The cause of the problem is an area of poor adherence between the green sheet and conductive paste in the laminated body. When there are many layers, or when the conductor on each layer is thick, there is a great difference in the thickness of the parts including the conductor and the parts with ceramic only, so that the laminated body is like a sandwich with a lot of filling (refer to Figure 7-17). Since this delamination occurs in order to release the stress within the laminated body, it takes a similar form to stepped interlayer delamination and circular delamination. 

Diffraction studies were carried out to investigate the delamination/exfo-liation of MMT in polymer matrix. A Bruker D8 Advance difiactometer was used to measure the d-spacing of the hybrid filler-filled nanocomposite films. The diffraction patterns were obtained at room temperature in the range 2<29<10 degree by step of 0.02°. The X-ray beam Cu Ka radiation (A. = 0.154 nm), operated at 30 kV and 10 mA. The interlayer distance was determined by the peak, using the Braggs equation... 

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