Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Squeegee speed

Screen/squeegee/substrate not parallel Variation in squeegee speed... [Pg.229]

Stencil printing is very similar to Ihis process except that it is normally conducted with zero snap-off distance, i.e., with the stencil s bottom surface in contact with the tape layer. Also in the case of stencil printing, higher squeegee speeds are used in the via-filling process to provide increased ink shear forces, thereby facilitating the flow of ink into the vias. [Pg.262]

Squeegee Speed Lower circuit coverage Higher coverage... [Pg.785]

Solder Paste Measurements. Typical solder paste measurements, shown in Fig. 53.8(a), are volume, area of pad covered, height, and misalignment with the pad. These quantitative measurements provide information about the paste viscosity, stencil registration, cleanhness, snap-off, and squeegee speed and pressure that can lead to improvement in the paste printing process. [Pg.1254]

Squeegee speed is decided by the printing time and viscosity of the paste when printing. In general, reducing squeegee speed increases the printing... [Pg.147]

The relationship between ink viscosity and squeegee speed can be analyzed using Eq. (8.61). [Pg.674]

The time t to fill the ink into the mesh is related to the squeegee speed V by... [Pg.675]

See other pages where Squeegee speed is mentioned: [Pg.180]    [Pg.219]    [Pg.1284]    [Pg.219]    [Pg.13]    [Pg.223]    [Pg.225]    [Pg.229]    [Pg.1256]    [Pg.147]    [Pg.148]    [Pg.149]    [Pg.323]    [Pg.325]    [Pg.673]    [Pg.674]    [Pg.675]    [Pg.677]    [Pg.20]   
See also in sourсe #XX -- [ Pg.13 ]

See also in sourсe #XX -- [ Pg.147 , Pg.148 ]



SEARCH



© 2024 chempedia.info