Sputtering process artifacts

If conversion of time-to-depth sputtered were the only problem, things would not be too bad since often relative concentrations as a function of depth are the main concern with the absolute value of the depth being of lesser importance. Many artifacts are introduced by the sputtering process itself, however, and these have to be carefully considered in evaluating any profile obtained using sputtering. The major artifacts are mentioned briefly below. 

During the sputtering process, many artifacts are introduced that can affect quantification some of these derive from the nature of the sample itself (e.g., roughness, crystalline structure, phase distribution, electrical conductivity), and others are ra-... 

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