Spin coating mathematical models

Thin solid films of polymeric materials used in various microelectronic applications are usually commercially produced the spin coating deposition (SCD) process. This paper reports on a comprehensive theoretical study of the fundamental physical mechanisms of polymer thin film formation onto substrates by the SCD process. A mathematical model was used to predict the film thickness and film thickness uniformity as well as the effects of rheological properties, solvent evaporation, substrate surface topography and planarization phenomena. A theoretical expression is shown to provide a universal dimensionless correlation of dry film thickness data in terms of initial viscosity, angular speed, initial volume dispensed, time and two solvent evaporation parameters. [Pg.261]

Flack WW, Soong DS, Bell AT, Hess DW (1984) A mathematical model for spin coating of polymer resists. J Appl Phys 56(4) 1199-1206... [Pg.304]