Soldering process conclusion

Pin in paste (PIP) technology, also know as alternate assembly and reflow technology (AART) by Universal Instruments and others, allow the use of THT parts with solder paste and reflow soldering. Paste is deposited onto the board at through-hole locations, the leads of a THT part are placed through the paste, and at the conclusion of the placement process the board and components are reflowed. The two major concerns with the use of the PIP process are the deposition of an adequate volume of solder paste and the use of THT components whose body can withstand reflow soldering temperatures. In the wave solder process, only component leads were raised to soldering temperatures, but in the reflow process the entire part must withstand the process temperatures. 

---