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SnCuNi alloys

Another issue to consider is the effects that solder alloys have on voids in plated through-hole (PTH) barrels. SnAgCu has shown to be more prone to voiding than tin/lead and SnCuNi alloys. If the leads are used for high-power resistance or temperature dissipation, this can be problematic. For many other applications, these voids will not cause... [Pg.34]

The following is a brief comparison of SnAgCu and SnCuNi alloys, which appear to be the most likely lead-free wavesoldering alloy candidates. [Pg.34]

See other pages where SnCuNi alloys is mentioned: [Pg.33]    [Pg.34]    [Pg.132]    [Pg.33]    [Pg.34]    [Pg.132]   
See also in sourсe #XX -- [ Pg.34 ]



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