Silicones stress dissipating properties

Associated with their low moduli and elastomeric properties is their ability to dissipate stresses and to act as stress buffers between harder, less flexible materials such as epoxies. Because of their stress-dissipating properties, soft silicones are often used to bond or encapsulate fragile components such as glass diodes, laser diodes, and electro-optical devices. However, the CTEs of elastomeric silicones are generally... 

This could be proved by solid-state NMR analysis, showing that the T3 content increases with curing time at the expense of the diphenyl T1 content (index means the number of oxygen bridges to other silicon atoms of the considered silicon atom). It was of interest to investigate how far the stress dissipation ability of the seal can be improved without reducing the sealing properties. Moreover, it was of further interest for practical reasons how far these systems are able to be adapted to polyimide surfaces in connection with copper as a counterpart. 

In addition to the construction of a multilevel interconnect network, the semiconductor industry also improves the performance of IC chips by incorporating low-resistivity metal wiring such as copper and new dielectric materials with lower k constant (see Section 1.3.1 for details). The added benefit of using low-fc dielectric materials includes a reduction in the crosstalk [29-31] and power dissipation [29-33]. The key challenge for the implementation of low-fc materials is related to their intrinsic weak mechanical properties. Furthermore, in order to achieve a k value below 2.2, practically all materials are made with pores that exacerbate mechanical stability issue [29-33]. This is a particular concern for the CMP community as the operation invariably involves mechanical stress and shear force. In addition, practically all low-fc dielectric materials are hydrophobic in nature. Lfpon exposure to moisture or wetness, the dielectric constant tends to increase. Therefore, unlike silicon-dioxide-based dielectric, the effective k constant may change after CMP. To... 

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