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Silicon characterization

Liquid crystalline polymers, with side-chains, 12, 306 Liquid crystalline silicones, characterization, 3, 667 Liquid crystals... [Pg.136]

The interest of metal deposition on silicon from fluoride solutions arises from several areas plating processes (usually as the activation step) [1], tools for silicon characterization (defect revealing, junction delineation) [2] or studies of the damaging effects due to metallic contaminants in cleaning solutions [3]. [Pg.160]

Silicone oils or siloxanes are polymeric compounds of silicon, characterized by... [Pg.377]

Increasing the surface-to-bulk ratio of the sample to be studied. This is easily done in the case of highly porous materials, and has been exploited for the characterization of supported catalysts, zeolites, sol-gels and porous silicon, to mention a few. [Pg.1779]

The silanols formed above are unstable and under dehydration. On polycondensation, they give polysiloxanes (or silicones) which are characterized by their three-dimensional branched-chain structure. Various organic groups introduced within the polysiloxane chain impart certain characteristics and properties to these resins. [Pg.1023]

Semiconductors may also be made from a maferial which is normally an insulator by infroducing an impurify, a process known as doping. Figure 9.9 shows fwo ways in which an impurify may promote semiconducting properties. In Figure 9.9(a) fhe dopanf has one more valence election per atom fhan fhe hosf and confribufes a band of filled impurify levels 1 close to fhe conduction band of fhe hosf. This characterizes an n-fype semiconductor. An example is silicon (KL3s 3p ) doped wifh phosphoms (KL3s 3p ), which reduces fhe band gap to abouf 0.05 eY Since kT af room femperafure is abouf 0.025 eY the phosphoms... [Pg.350]

Physical Properties. Raman spectroscopy is an excellent tool for investigating stress and strain in many different materials (see Materlals reliability). Lattice strain distribution measurements in siUcon are a classic case. More recent examples of this include the characterization of thin films (56), and measurements of stress and relaxation in silicon—germanium layers (57). [Pg.214]

Soft magnetic materials are characterized by high permeabiUty and low coercivity. There are sis principal groups of commercially important soft magnetic materials iron and low carbon steels, iron—siUcon alloys, iron—aluminum and iron—aluminum—silicon alloys, nickel—iron alloys, iron-cobalt alloys, and ferrites. In addition, iron-boron-based amorphous soft magnetic alloys are commercially available. Some have properties similar to the best grades of the permalloys whereas others exhibit core losses substantially below those of the oriented siUcon steels. Table 1 summarizes the properties of some of these materials. [Pg.368]

If a sample of polycrystalline material is rotated during the sputtering process, the individual grains will be sputtered from multiple directions and nonuniform removal of material can be prevented. This technique has been successfully used in AES analysis to characterize several materials, including metal films. Figure 9 indicates the improvement in depth resolution obtained in an AES profile of five cycles of nickel and chromium layers on silicon. Each layer is about 50 nm thick, except for a thinner nickel layer at the surface, and the total structure thickness is about 0.5 pm. There can be a problem if the surface is rough and the analysis area is small (less than 0.1-pm diameter), as is typical for AES. In this case the area of interest can rotate on and off of a specific feature and the profile will be jagged. [Pg.708]

The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processir, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the materials user s point of view. Thus, in general, the format is based on properties, processing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summaries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Encyclopedia. [Pg.763]

Crivello, J.V. and Lee, J.L., The synthesis, characterization and photoinitiated cationic polymerization of silicon-containing epoxy resins. J. Polym. Sci. Polym. Chem. Ed., 28, 479-503 (1990). [Pg.1037]

Containing up to 3% silicon, silicon bronzes are characterized by high mechanical and antifriction properties. They are made in all wrought forms. [Pg.81]

Boron (like silicon) invariably occurs in nature as 0X0 compounds and is never found as the element or even directly bonded to any other element than oxygen. The structural chemistry of B-O compounds is characterized by an extraordinary complexity and diversity which rivals those of the borides (p. 145) and boranes (p. 151). In addition, vast numbers of predominantly organic compounds containing B-O are known. [Pg.203]

The elementary building block of the zeolite crystal is a unit cell. The unit cell size (UCS) is the distance between the repeating cells in the zeolite structure. One unit cell in a typical fresh Y-zeolite lathee contains 192 framework atomic positions 55 atoms of aluminum and 1atoms of silicon. This corresponds to a silica (SiOj) to alumina (AI.O,) molal ratio (SAR) of 5. The UCS is an important parameter in characterizing the zeolite structure. [Pg.86]

Modern organic chemistry is characterized by the many reactions that have been developed in which new heteroatoms are involved— new , as distinct from the traditional heteroatoms of oxygen, nitrogen, sulphur and perhaps even phosphorus. Especially prominent in this new chemistry are tin and silicon, and it is not surprising to find these have been allied with sulphur in novel approaches to syntheses. These novel reactions are often characterized by the mild conditions under which they occur. [Pg.954]


See other pages where Silicon characterization is mentioned: [Pg.4453]    [Pg.4452]    [Pg.832]    [Pg.893]    [Pg.4453]    [Pg.4452]    [Pg.832]    [Pg.893]    [Pg.123]    [Pg.130]    [Pg.1780]    [Pg.1784]    [Pg.1785]    [Pg.1838]    [Pg.2398]    [Pg.2804]    [Pg.52]    [Pg.49]    [Pg.400]    [Pg.140]    [Pg.439]    [Pg.663]    [Pg.696]    [Pg.269]    [Pg.287]    [Pg.704]    [Pg.329]    [Pg.340]    [Pg.119]    [Pg.24]    [Pg.410]    [Pg.365]    [Pg.116]    [Pg.576]    [Pg.450]    [Pg.724]    [Pg.7]    [Pg.57]    [Pg.59]   
See also in sourсe #XX -- [ Pg.46 , Pg.48 ]

See also in sourсe #XX -- [ Pg.400 , Pg.401 ]




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